HBM Memory: SK hynix, Samsung, Micron — 2026-10-10
Samsung Electronics reported a record Q3 operating profit of 107.4 trillion won, driven by surging HBM4 demand, while AMD confirmed it has begun receiving HBM4 supplies from both Samsung and SK hynix. Meanwhile, Micron reported record fiscal results with HBM sold out through 2027, and Nvidia’s Vera Rubin platform is expected to retain 12-layer HBM4 stacks, easing concerns about immediate shifts to 16-layer configurations.
HBM Memory: SK hynix, Samsung, Micron — 2026-10-10
Top developments
AMD begins receiving HBM4 from Samsung and SK hynix
On October 7, AMD CEO Lisa Su met with Samsung Electronics chip chief Jun Young-hyun in Seoul, confirming that AMD has started receiving HBM4 memory from both Samsung and SK hynix. This move is critical for AMD’s Helios AI rack deal, as Nvidia has largely locked up SK hynix’s 2026 HBM4 output, leaving AMD with limited alternatives. The partnership signals a multi-generation commitment to these suppliers for next-gen AI accelerators, potentially shifting supply share dynamics away from Micron in the short term.
Samsung Q3 profit surges 780% on HBM4 demand
Samsung Electronics released preliminary Q3 2026 guidance on October 8, reporting an estimated operating profit of 107.4 trillion won, a 780% year-on-year increase. This record performance is attributed to strong demand for HBM4 and server DRAM, despite a 14% surge in the South Korean won acting as a headwind to margins. The results confirm that the AI memory supercycle is delivering substantial profitability gains, even as DRAM contract prices face pressure from currency fluctuations.
Nvidia Vera Rubin retains 12-layer HBM4 stacks
Nvidia’s Vera Rubin AI platform is expected to rely primarily on 12-layer HBM4 chips rather than transitioning immediately to 16-layer stacks, according to reports published on October 9. This decision, based on Counterpoint Research data, eases production yield concerns for SK hynix and Samsung, who were facing challenges scaling hybrid bonding for higher layer counts. The retention of 12-layer configurations supports current capacity expansions and stabilizes pricing negotiations for 2027 contracts.
Micron reports record revenue; HBM sold out through 2027
Micron Technology announced fiscal year 2026 results with revenue rising 256% to $133.19 billion, noting that HBM capacity is sold out through 2027. The company stated that HBM4 revenue has already surpassed $1 billion, with 12-high HBM4 production ramping faster than the previous HBM3E generation. Despite this success, Micron stock fell slightly as investors weighed the massive capital expenditure plans required to meet future demand, with significant new supply not expected until 2028.
Local view
Korean media highlight Samsung's HBM4E qualification and pricing power Local outlets such as The Korea Economic Daily (Hankyung) reported on October 7 that Samsung’s next-generation 12-layer HBM4E products have passed quality verification tests for major customers, including Nvidia. This qualification milestone is seen as a critical step in narrowing the technological gap with SK hynix. Additionally, Chosun Biz reported that Samsung is negotiating to double HBM4 supply prices for next year, citing severe DRAM shortages and rising component costs. These moves reflect a shift toward supplier dominance in contract negotiations.
Context & numbers
- Samsung Q3 2026 Operating Profit: 107.4 trillion won (~$78 billion USD equivalent), up 780% YoY.
- Micron FY2026 Revenue: $133.19 billion, up 256.33% YoY.
- HBM4 Pricing Trends: Samsung is seeking price increases of more than 100% for 2027 HBM4 contracts, reflecting the "supplier's market" status.
- DRAM Inventory Levels: Global DRAM inventory at major suppliers has dropped below 10 days of supply, exacerbating the shortage.
On the radar
- Micron Strike Risk in Taiwan: A union vote at Micron’s key Taichung fab passed with 99% approval for a strike, which could disrupt supply and benefit Samsung and SK hynix if executed.
- ASML Cost Increases: ASML is raising replacement parts prices by 10%, increasing operational costs for Samsung and SK hynix fabs.
- Nvidia Rubin Ultra Spec Rumors: Reports suggest Nvidia may reduce HBM capacity in "Rubin Ultra" variants to 192GB (down from 288GB) due to supply constraints, though this remains unconfirmed by official spec sheets.
This content was collected, curated, and summarized entirely by AI — including how and what to gather. It may contain inaccuracies. Crew does not guarantee the accuracy of any information presented here. Always verify facts on your own before acting on them. Crew assumes no legal liability for any consequences arising from reliance on this content.
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