On-Device AI Silicon: Apple, Qualcomm, MediaTek NPUs — 2026-09-16
MediaTek has launched the Dimensity 9600 Pro, the first merchant silicon on TSMC's 2nm process, capable of running 30-billion-parameter AI models locally. Qualcomm is set to counter with its Snapdragon Summit announcements next week, featuring a new Hexagon NPU architecture with MoE support. Meanwhile, ARM-based PC market share has hit a record high as Intel's Core Ultra X9 begins shipping.
On-Device AI Silicon: Apple, Qualcomm, MediaTek NPUs — 2026-09-16
Top developments
MediaTek Dimensity 9600 Pro: First 2nm Merchant Silicon
On September 15, 2026, MediaTek unveiled the Dimensity 9600 Pro and 9600M, becoming the first merchant vendor to ship a smartphone processor on TSMC’s 2nm process. The chip features a new "2 + 3 + 3" CPU cluster, LPDDR6 RAM support, and an NPU capable of handling 30-billion-parameter local AI models. This move allows Android flagships to run heavier LLMs on-device without cloud dependency, directly challenging Apple’s A-series and Qualcomm’s upcoming Snapdragon platforms.
Qualcomm’s Hexagon NPU Upgrade for MoE Models
Ahead of the Snapdragon Summit (Sept 22–24), Qualcomm detailed its next-generation Hexagon NPU, which introduces an "Element Accelerator" and native support for Mixture-of-Experts (MoE) architectures. This upgrade targets "always-on" agentic AI, enabling phones to run up to 30-billion-parameter models efficiently while reducing memory usage. Reports indicate Qualcomm will launch two 2nm flagship chips, the SM8950 (likely exclusive to Xiaomi for six months) and the higher-performance SM8975, to compete directly with MediaTek’s new lead.
ARM Hits Record PC Share as Intel Ships Core Ultra X9
ARM-based processors have reached a record 15.3% share of the PC market as Intel’s Core Ultra X9 (Panther Lake) laptops begin retail distribution. This shift highlights the growing viability of ARM in AI PCs, driven by efficiency gains from chips like the Snapdragon X Elite and Apple M-series. Samsung also launched the $799 Galaxy Book6, powered by Intel’s 18A Wildcat Lake chips, aiming to bring AI PC capabilities to the mass market.
Local view
In China, media outlets like Pacific Technology (太平洋科技) are highlighting the strategic split in Qualcomm’s 2nm rollout, noting that Xiaomi may secure exclusive early access to the SM8950 chip, signaling a tightening of OEM-chipmaker relationships. Sun Media (商傳媒) emphasizes that Qualcomm’s new NPU integration of MoE architecture is specifically designed to enable "assistant-type AI" that can operate constantly in the background, a key feature for the emerging agent economy. Korean press, including Maeil Business Newspaper, reports on Samsung’s Exynos chips finally outperforming Snapdragon in specific AP tests, suggesting improved cost competitiveness for Galaxy devices if the trend holds.
Context & numbers
- AI PC Penetration: Counterpoint Research projects that AI Advanced PCs will reach ~59% of global shipments in 2026, up from ~39% in 2025.
- GenAI Smartphone Share: Statista forecasts the shipment share of GenAI-capable smartphones will grow by 17 percentage points between 2025 and 2027.
- Market Moves: Amazon’s reported $60 billion deal with Qualcomm lifted an AI strategy’s chip bet by nearly 9%, reflecting massive corporate demand for custom silicon.
On the radar
- Snapdragon Summit 2026: Scheduled for September 22–24 in Hawaii, where Qualcomm is expected to officially launch the Snapdragon 8 Elite Gen 6 (SM8950/SM8975) and detail final NPU TOPS figures.
- Googlebook Pre-orders: Google’s Gemini-powered laptops open for pre-order on September 21 at $999, featuring Magic Pointer and deep AI OS integration.
This content was collected, curated, and summarized entirely by AI — including how and what to gather. It may contain inaccuracies. Crew does not guarantee the accuracy of any information presented here. Always verify facts on your own before acting on them. Crew assumes no legal liability for any consequences arising from reliance on this content.
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